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 MITSUBISHI SEMICONDUCTOR
MGFS45V2735
2.7 - 3.5GHz BAND 30W INTERNALLY MATCHED GaAs FET DESCRIPTION
The MGFS45V2735 is an internally impedance-matched GaAs power FET especially designed for use in 2.7 - 3.5 GHz band amplifiers. The hermetically sealed metal-ceramic package guarantees high reliability.
O U TLIN E
2 4 + /- 0 .3
u nit : m m
2M IN
FEATURES
Class A operation Internally matched to 50(ohm) system High output power P1dB = 30W (TYP.) @ f=2.7 - 3.5 GHz High power gain GLP = 12 dB (TYP.) @ f=2.7 - 3.5GHz High power added efficiency P.A.E. = 36 % (TYP.) @ f=2.7 - 3.5GHz Low distortion [item -51] IM3=-45dBc(TYP.) @Po=34.5dBm S.C.L.
(1 ) R 1 .2
0 .6 + /- 0 .1 5
17.4 +/- 0.2
8.0 +/- 0.2
(2 )
2M IN
(3 ) 2 0 .4 + /- 0 .2
APPLICATION
item 01 : 2.7 - 3.5 GHz band power amplifier item 51 : 2.7 - 3.5 GHz band digital radio communication
0.1 +/- 0.05
Limits Typ. 24 8 45 12 8 36 -45 0.8 Max. -5 1
1 6 .7
QUALITY GRADE
IG
VDS = 10 (V) ID = 8 (A) RG=25 (ohm)
1.4
RECOMMENDED BIAS CONDITIONS
4.3 +/- 0.4
G F-38
(Ta=25deg.C) Ratings -15 -15 20 -80 168 150 175 -65 / +175 Unit V V A mA mA W deg.C deg.C
(1 ) ga te (2 ) sou rce (fla ng e ) (3 )dra in
< Keep safety first in your circuit designs! >
ABSOLUTE MAXIMUM RATINGS
Symbol VGDO VGSO ID IGR IGF PT *1 Tch Tstg Parameter Gate to drain voltage Gate to source voltage Drain current Reverse gate current Forward gate current Total power dissipation Channel temperature Storage temperature
Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (1)placement of substitutive, auxiliary circuits, (2)use of non-flammable material or (3)prevention against any malfunction or mishap.
*1 : Tc=25deg.C
ELECTRICAL CHARACTERISTICS
Symbol IDSS gm VGS(off) P1dB GLP ID P.A.E. IM3 *2
Rth(ch-c) *3
(Ta=25deg.C) Test conditions VDS = 3V , VGS = 0V VDS = 3V , ID = 8A VDS = 3V , ID = 160mA Min. -2 44 VDS=10V, ID(RF off)=8A, f=2.7 - 3.5GHz 11 -42 delta Vf method Unit A S V dBm dB A % dBc
deg.C/W
Parameter Saturated drain current Transconductance Saturated drain current Output power at 1dB gain compression Linear power gain Drain current Power added efficiency 3rd order IM distortion Thermal resistance
*2 : item -51,2 tone test,Po=34.5dBm Single Carrier Level,f=2.7,3.1,3.5GHz,delta f=10MHz
*3 : Channel-case
MITSUBISHI ELECTRIC
June-'04
2.4 +/- 0.2
MITSUBISHI SEMICONDUCTOR
MGFS45V2735
2.7 - 3.5GHz BAND 30W INTERNALLY MATCHED GaAs FET
TYPICAL CHARACTERISTICS
P1dB,GLP vs. f 47 VDS=10V ID=8A 46 22 50 VDS=10V ID=8A f=3.1GHz 45 80 Po 40 60 Po,P.A.E. vs. Pin 100 111
P1dB
20
OUTPUT POWER P1dB (dBm)
LINEAR POWER GAIN GLP (dB)
OUTPUT POWER Po (dBm)
45
18
44
16
35 P.A.E.
40
43
GLP
14
42
12
30
20
41 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 FREQUENCY f (GHz) 3.4 3.5 3.6
10
25 15 20 25 30 INPUT POWER Pin (dBm) 35 40
0
Po,IM3 vs. Pin
42 40
VDS=10V IDS=8A f=3.5GHz Delta f=10MHz 2-tone test
20 10
OUTPUT POWER Po (dBm) S.C.L.
38 36 34
Po
0 -10 -20 -30 -40 -50 -60
32 30 28 26 18 20 22 24 26 28 INPUT POWER Pin (dBm) S.C.L. 30
S parameters
f (GHz) 2.60 2.70 2.80 2.90 3.00 3.10 3.20 3.30 3.40 3.50 3.60
( Ta=25deg.C , VDS=10(V),IDS=8(A) ) S-Parameter (TYP.) S21 S12 Magn. Angle(deg) Magn. Angle(deg) 3.39 38 0.03 -17 3.90 3 0.04 -52 4.30 -31 0.05 -86 4.52 -66 0.06 -122 4.51 -101 0.06 -157 4.33 -135 0.06 166 4.15 -168 0.05 134 4.04 159 0.06 100 3.92 117 0.06 49 3.60 76 0.06 8 2.86 33 0.05 -40 S22 Angle(deg) 26 -1 -30 -67 -106 -137 -165 174 149 165 -115
S11 Magn. Angle(deg) 0.63 88 0.58 47 0.51 1 0.47 -51 0.47 -105 0.50 -152 0.51 166 0.49 123 0.45 61 0.48 -11 0.64 -75
IM3 (dBc)
IM3
Magn. 0.59 0.49 0.41 0.32 0.27 0.24 0.23 0.21 0.15 0.05 0.16
MITSUBISHI ELECTRIC
June-'04
POWER ADDED EFFICIENCY P.A.E. (%)
MITSUBISHI SEMICONDUCTOR
MGFS45V2735
2.7 - 3.5GHz BAND 30W INTERNALLY MATCHED GaAs FET
MITSUBISHI ELECTRIC
June-'04


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